|
Feature：
- Exclusive machine structure, particularly built for the high-accuracy grinding machining of brittle and hard materials
- JIATIE system internal grinding package, improves micron level machining accuracy and consistency of mass production
- Independently researched and developed integrated spindle technology, reduces cutting tool run-out and vibration produced by extremely high rotation speed.
Machining material：
hard and brittle materials such as glass, ceramic, sapphire, silicon carbide, silicon nitride and etc, titanium, engineering plastics
Application area：
Machining for industry applications of aviation and aerospace, medical product, semi-conductor, 3C, LED display module, high speed communication, etc
|
400-889-8833
Download
Back
Service Hotline
